1. Product description：

This product is A two-component heat curing epoxy potting adhesive, which is composed of A and B liquid, low viscosity, easy flow, good defoaming. The cured material has good insulation, resistance to moisture and heat aging, and can protect, waterproof and moisture-proof electronic products and seal them. The rubber material is non-toxic; Moderate viscosity, easy to defoaming, yellow resistance。

2、product characteristics：

◆ Gentle hardening reaction, low stress；

◆ The product has no corrosion to metal, plastic and other materials, and will not cause damage and destruction to the substrate；

◆ The hardened rubber material is non-toxic, no low molecular matter is released, good insulation performance, and does not affect the electrical performance of the product；

◆ The hardened material has high strength, good toughness, and can withstand external forces and hot and cold shocks well；

◆ No bubbles after curing；

3、product application：

It is suitable for potting and sealing of electronic components/circuit boards (such as small transformers, ignition coils, power modules, etc.)。