Product Description:

This product is a two-component, addition-cure silicone material that cures at room temperature or with heat. It is designed for potting and protecting electronic devices in harsh environments. Once cured, it forms an elastic buffer material that helps reduce mechanical stress and strain caused by mechanical shocks, thermal cycling, and vibrations. The product offers excellent high-frequency electrical performance, is solvent-free, and produces no by-products during curing.

Product Features:

◆ Soft, stress-free elastomer with excellent shock and vibration resistance.
◆ Long-lasting elasticity and hardness, resistant to aging.
◆ Cures at room temperature or with heat for fast curing, with minimal shrinkage.
◆ Stable high-frequency electrical properties, solvent-free, and no curing by-products.
◆ Transparent and repairable.

Applications:

Suitable for cushioning and shock protection of precision electronic and electrical components, as well as potting protection for high-power IGBT modules.